High density wiring design of FPC
Free grounding film (for shielding film)FGF®-500
Free ground bonding film (for shielding film)FGBF®-700
Overview (FGF-500)
In order to maximize the shield effect, optimum grounding (multiple point ground) is required, while on the other hand it is difficult to secure a sufficient GND area due to trends toward downsizing and high density wiring of FPC. The FGF-500 can connect the FPC GND with external GND through the underlaying shielding film. Also, stable joint resistance is achieved due to the Au-plated outermost layer.
The FGF demonstrates its ability because the shield effectiveness can be improved by multi-point grounding of GND.
Use of the FGF enables wiring over the entire FPC.
Downsizing of the FPC is also expected.
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GND formed on the FPC side 
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Case (1) where the FGF is adopted 
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Case (2) where the FGF is adopted 
Overview (FGBF-700)
When camera modules and B2B connectors to be installed in smartphones and other electronic devices are mounted on FPC, Ni-SUS and other metallic stiffeners are used, while on the other hand it is difficult to secure a sufficient GND area due to the trends toward downsizing and high density wiring of FPC in step with miniaturization of electronic devices. The FGBF-700 can bond the FPC and metallic stiffeners and connect the FPC GND with external GND through underlaying shielding films and metallic stiffeners.
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●In the case where coverlay opening cannot be provided due to the narrow outer width of FPC
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●In the case where no shielding film can be bonded in between due to the narrow stiffener spacing
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● In the case where coverlay opening cannot be provided due to the large number of wiring of FPC
