Shielding film for Rigid-flex board
(in between there is high step)

WILMINA®
SF-PC®6000-U1N
SF-PC®6000-U1-US

UL94 VTM-0 (combined with Kapton50H)
*Kapton® is a registered trademark of DuPont in the U.S.

Product Overview

This shielding film offers step followability for Rigid-flex board. When bonding over both rigid circuit board and FPC areas, the SF-PC6000-U1N/U1-US demonstrates high followability to steps. While the SF-PC6000-U1N is widely adopted in Rigid-flex board applications, the SF-PC6000-U1-US resistant to ultrasonic cleaning solutions is adopted for cases where ultrasonic cleaning is performed for camera modules.

Features

Followability to high steps

Compatible with 400μm or fewer steps with improved followability to high steps.
Use of isotropic conductive adhesive

Offers shield performance of over 55dB/1GHz, which is the same as the SF-PC5600/5900, with use of an isotropic conductive adhesive as the isotropic conductive adhesion layer acts as a shielding layer, without use of a single-element shielding layer.
Ultrasonic cleaning resistance
(SF-PC6000-U1-US)

Capable of withstanding ultrasonic cleaning solutions (*) for cases where ultrasonic cleaning is performed on camera modules making heavy use of Rigid-flex board.
* Not resistant to all ultrasonic cleaning solutions.

Shielding film for Rigid-flex board</br> (in between there is high step)

Main specifications

Item		SF-PC6000-U1N	SF-PC6000-U1-US
Thickness Transfer film (white)		60μm	57μm
Total thickness (after press)		16μm	16μm
	Protection layer	6μm	6μm
	Isotropic conductive adhesion layer	10μm	10μm
Protection film		75μm	75μm
Peeling strength		Over 3.0N/cm	Over 3.0N/cm
Shelf life (keep cool)		4 months	4 months