Product Overview
This shielding film is a heat-sealing type (thermoplastic). Total thickness is reduced by thin-film formation technology. Being lightweight and superior in bending property, it is ideal for shielding mobile devices and various cable materials. It is widely adopted as a shielding material for consumer equipment and flexible flat cables for TVs. Also, the adoption of the SF-FC500, which has achieved 125°C heat resistance upon request for high reliability, has expanded in in-vehicle applications.
Features
-
Ultralight and high bending property(SF-FC700)
Small in product thickness, lightweight, and superior in bending property.
-
Low-temperature and short-time bonding
The thermoplastic conductive adhesive facilitates bonding with various base materials. -
Excellent shield characteristics
Offers excellent shield performance by the metallic thin film layer.(SF-FC700)
Aluminum foil (10μm) realizes even higher shielding performance.(SF-FC500) -
High heat resistance (SF-FC500)
Achieves 125℃ heat resistance required in in-vehicle applications.
Main specifications
| Item | SF-FC700 | SF-FC500 | |
|---|---|---|---|
| Total thickness (after press) | 29μm | 45μm | |
| Base film | 9μm | 12μm | |
| Interlayer adhesive layer | - | 3μm | |
| Shielding layer | 0.1μm | 10μm(aluminum foil) | |
| Conductive adhesion layer (thermoplastic) | 20μm | 20μm | |
| Peeling strength | Over 4.0N/cm | Over 4.0N/cm | |
| Shelf life (at room temperature) | 6 months | 6 months | |
Examples of Use
-
Car navigation systems
-
Display (Automotive)
-
Video game
Reference data
-
KEC Method: electric field shielding effect
-
KEC Method: magnetic field shielding effect
-
Joint resistance(125℃)
-
Conduction resistance(125℃)
* Above data and numerical values are all actual measurement values, not guaranteed values.
