UL94 V-0 (combined with Kapton50H)
* Kapton® is a registered trademark of DuPont in the U.S.
Product Overview
As the conductive fillers contained in the conductive adhesive contact the shielding layer of the shielding film, FPC GND can be drawn out externally. Also, stable joint resistance is achieved due to the Au-plated outermost layer.
* We do not guarantee any combination with other products than TATSUTA-manufactured shielding films.
Features
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Enables drawing out GND
from any place on the shielding filmGND for external connection can be secured in the FPC wiring area. -
Enables high-density wiring of boards
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Achieves ultra-thinness of 12μm in total thickness (FGF-500)
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Compatible with small areas (FGF-800)
Main specifications
| Item | FGF-500 | FGF-800 | |
|---|---|---|---|
| Thickness Reinforcing film (blue) | 64μm | 64μm | |
| Total thickness (after press) | 12μm | 16μm | |
| Plating layer (The outermost layer is Au-plated.) |
About 0.5μm | About 0.5μm | |
| Cu foil layer | 6μm | 6μm | |
| Anisotropic conductive adhesion layer | 6μm | 10μm | |
| Joint resistance value
* FGF size: 10mm x 5mm |
Under 1.0Ω | Under 1.0Ω | |
| Peeling strength | Over 3.0N/cm | Over 3.0N/cm | |
| Shelf life (keep cool) | 6 months | 6 months | |
Examples of Use
Use of the FGF enables wiring over the entire FPC, by which downsizing of the FPC is also expected. Multi-point grounding of GND for the purpose of high density wiring of FPC and improvement in shield performance can be designed.
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GND formed on the FPC side 
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Case (1) where the FGF is adopted 
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Case (1) where the FGF is adopted 
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Application image
GND can be secured in any place on the shielding film.
Reference data
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Joint resistance value by shielding film/FGF size (FGF-800)
* Above data and numerical values are all actual measurement values, not guaranteed values.
Download reference materials
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