Peripheral material (non-conductive)
NCBF-100-D8
Thermal setting non-conductive bonding film
NCBF-100-D8
NCBF-100-D25
Product Overview
A thermal setting adhesive is used for this non-conductive bonding film. Demonstrates excellent adhesiveness to various materials. Our unique technology achieves a product thickness of 8μm, contributing to the realization of thinning boards. According to FPC design, you can select from 8µm or 25µm product.
Features
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Product thickness
Industry’s thinnest bonding film (8μm). -
Excellent adhesiveness
Enables bonding to various materials. -
Environmental test resistance
Offers stable peeling strength even after environmental test at 65℃ and 90% for 1,000 hours.
Main specifications
| Item | NCBF-100-D8 | NCBF-100-D25 | |
|---|---|---|---|
| Thickness Separator | 38μm | 38μm | |
| Thickness Non-conductive adhesion layer | 8μm | 25μm | |
| Peeling strength (N/cm) | Ni-SUS | 12 | 15 |
| PI | 19 | 20 | |
| Cu | 16 | 16 | |
| Shelf life (at room temperature) | 6 months | 6 months | |
Reference data
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Peeling strength
Peeling strength: 90-degree peel test
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Peeling strength after environmental test (65℃, 90%, 1,000 hours)
* Above data and numerical values are all actual measurement values, not guaranteed values.
