Thermal setting conductive bonding film

WILMINA®
CBF®300/-W6
CBF®800-D40/-D60

UL94 VTM-0 (combined with Kapton200H) * CBF-800-D40/-D60
* Kapton® is a registered trademark of DuPont in the U.S.

Product Overview

When smartphone camera modules or B2B connectors are mounted on FPC boards, stiffeners are bonded as a backing material. When polyimide stiffeners are used, the CBF series functions as a shield, and when Ni-SUS or other metallic stiffeners are used, Ni-SUS and FPC GND can be connected with a stable resistance value. The CBF series also offers stable performance after reflowing due to the excellent heat resistance. In particular, the CBF-800-D40/-D60 is superior in high temperatures and humidity resistance.

Features

Excellent peeling strength in response to various base materials

Offers excellent peeling strength in response to metallic stiffeners and various other adherends.
Strengthening of GND

Enables electrically connecting FPC GND circuits and metallic stiffeners.
High temperatures and humidity resistance (CBF-800-D40/-D60)

Maintains a stable resistance value during environmental test at 85℃ and 85%Rh.

Main specifications

Item		CBF-300	CBF-300-W6	CBF-800-D40	CBF-800-D60
Product thickness (after press)		22μm	42μm	28μm	45μm
Peeling strength	vs. Ni-SUS	Over 10N/cm
Peeling strength	vs. polyimide	Over 10N/cm
Shelf life (keep cool)		4 months		5 months
Features		Thin	Step-compatible	High humidity resistance Thin	High humidity resistance Step-compatible

Examples of Use

In the case of Ni-SUS stiffener
The FPC GND is connected to
external GND through Ni-SUS.
In the case of polyimide stiffener
The CBF functions as a shield.