Conductive adhesive
WILMINA®
Thermal setting conductive bonding film (high reliability)
WILMINA®
CBF®900-D40/-D60
UL94 VTM-1 (combined with Kapton200H) * CBF-900-D40/-D60
* Kapton® is a registered trademark of DuPont in the U.S.
Product Overview
Maintains excellent joint reliability and peeling strength even under an environment of 85℃ and 85% for 2,000 hours. This product has improved embeddability in a vacuum quick press.
Features
-
Excellent bonding property with various base materials
Offers excellent bonding property with metallic stiffeners and various other adherends. -
Strengthening of GND
By electrically connecting FPC GND circuits and metallic stiffeners, GND can be strengthened in component packaging areas. -
High temperature and humidity resistance
Higher joint reliability and peeling strength are achieved during environmental tests at 85℃ and 85%Rh.
Main specifications
| Item | CBF-900-D40 | CBF-900-D60 | |
|---|---|---|---|
| Thickness Transfer film (white) | 50um | 50um | |
| Product thickness | Before press | 42um | 60um |
| After press | 32um | 49um | |
| Peeling strength | vs. Ni-SUS304 | Over 8N/cm | Over 8N/cm |
| vs. polyimide | Over 8N/cm | Over 8N/cm | |
|
Shelf life (keep cool) | 8 months | 6 months | |
Examples of Use
Reference data
High temperature and humidity test (85℃, 85%Rh, 2,000 hours)
-
・Joint resistance
-
・Peeling strength
* The above show reference values, not guaranteed values.
* Above data and numerical values are all actual measurement values, not guaranteed values.
