Product Overview
This heat-sealing type (thermoplastic) functional conductive film can control the impedance of flexible flat cables (FFC). It is designed so that the differential impedance of 100Ω required in LVDS transmission lines can be achieved by bonding the film to both sides of FFC. Also, because of the thin and lightweight design, the original flexibility of FFC is not impaired.
Features
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Electrical characteristics
Due to the mesh structure of the conductor, the differential impedance of 100Ω suitable for LVDS is achieved. -
Ultralight and high bending property
Small in product thickness, lightweight, and superior in bending property. -
Low-temperature and short-time bonding
The thermoplastic conductive adhesive facilitates bonding with various base materials.
Main specifications
Item | SF-FC334 | SF-FC374 | |
---|---|---|---|
Total thickness (after press) | 32μm | 32μm | |
Base film | 12μm | 12μm | |
Shielding layer | 0.1μm | 0.1μm | |
Pitch | L=0.3mm | L=0.3mm | |
S=2.7mm | S=6.7mm | ||
Conductive adhesion layer (thermoplastic) | 20μm | 20μm | |
Peeling strength | Over 3.0N/cm | Over 3.0N/cm | |
Shelf life (at room temperature) | 6 months | 6 months |
* Above data and numerical values are all actual measurement values, not guaranteed values.