Simplification of Cu foil-based shielding film processes
Shielding film for high speed signal transmission FPC (bake-less)

WILMINA®
SF-PC®3500P2-C

Overview

As development of the 5G communications network continues to progress globally, there is an increasing demand for shielding films high in shield performance for FPC in electronic devices. Also, for the purpose of reducing process loads on customers, shielding films not requiring baking before reflowing are demanded. The SF-PC3500P2-C is a shielding film that offers excellent processability, while also offering excellent electrical characteristics at high frequency bands with use of perforated copper formed by our special fabrication method.

●Appearance after moisture absorption and reflowing (bake-less)
- ●Copper shield (no opening)
  
  Presence of
  swelling
- ●SF-PC3500P2-C
  
  Absence of
  swelling
●Insertion loss
●Electric field shield effectiveness by KEC method
●Magnetic field shield effectiveness by KEC method